Estudio Numérico Mediante CFD del Proceso de Enfriamiento con Intercambiadores de Calor en Sistemas Computacionales
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Publicado:
ene 27, 2021
Palabras clave:
Enfriamiento, CFD, ANSYS, intercambiador de calor.
Contenido principal del artículo
Resumen
El presente artículo científico trata el estudio y simulación de un radiador que se basa en un intercambiador de calor tubular de flujo cruzado, el cual tiene un propósito de refrigerar el procesador, tarjeta gráfica de una CPU o diversos hardware en los sistemas de computación. Se realizan diversas simulaciones en el programa ANSYS teniendo varias temperaturas de ingreso que van en rangos desde 75 °C hasta 90 °C y con flujos másicos diferentes. Los resultados muestran que, al aumentar la temperatura de ingreso del fluido a refrigerar, la salida de este fluido tambien aumenta. Sin embargo, cuando se aumenta el flujo másico existe una merma en el rechazo de calor en los dispositivos computacionales.
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Cómo citar
Toapanta, F., Cortéz, J., Quitiaquez, W., & Orellana, W. (2021). Estudio Numérico Mediante CFD del Proceso de Enfriamiento con Intercambiadores de Calor en Sistemas Computacionales . Revista Técnica "energía", 17(2), PP. 55–64. https://doi.org/10.37116/revistaenergia.v17.n2.2021.422
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EFICIENCIA ENERGÉTICA
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La Revista Técnica "energía" está bajo licencia internacional Creative Commons Reconocimiento-NoComercial 4.0.
Citas
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[5] N. Raja Kuppusamy and L. Poh Seng, “Study on thermal and hydrodynamic performance of a triple fluid heat exchanger with different passes and rows,” Energy Procedia, vol. 158, pp. 5901–5906, 2019, doi: 10.1016/j.egypro.2019.01.534.
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[8] Y. Fan, C. Winkel, D. Kulkarni, and W. Tian, “Analytical Design Methodology for Liquid Based Cooling Solution for High TDP CPUs,” Proc. 17th Intersoc. Conf. Therm. Thermomechanical Phenom. Electron. Syst. ITherm 2018, pp. 582–586, 2018, doi: 10.1109/ITHERM.2018.8419562.
[9] T. A. Shedd and R. A. Morell, “Cooling 11.6 TFlops (1500 watts) in an office environment,” Annu. IEEE Semicond. Therm. Meas. Manag. Symp., pp. 122–124, 2017, doi: 10.1109/SEMI-THERM.2017.7896918.
[10] G. R. Wagner et al., “Test results from the comparison of three liquid cooling methods for high-power processors,” Proc. 15th Intersoc. Conf. Therm. Thermomechanical Phenom. Electron. Syst. ITherm 2016, pp. 619–624, 2016, doi: 10.1109/ITHERM.2016.7517605.
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[12] S. O. Tan and H. Demirel, “Performance and cooling efficiency of thermoelectric modules on server central processing unit and Northbridge,” Comput. Electr. Eng., vol. 46, pp. 46–55, 2015, doi: 10.1016/j.compeleceng.2015.07.012.
[13] A. C. Kheirabadi and D. Groulx, “Experimental evaluation of a thermal contact liquid cooling system for server electronics,” Appl. Therm. Eng., vol. 129, pp. 1010–1025, 2018, doi: 10.1016/j.applthermaleng.2017.10.098.
[14] W. Wang, L. Chen, Y. Kong, L. Yang, Y. Niu, and X. Du, “Cooling performance evaluation for double-layer configuration of air-cooled heat exchanger,” Int. J. Heat Mass Transf., vol. 151, p. 119396, 2020, doi: 10.1016/j.ijheatmasstransfer.2020.119396.
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[18] L. Bilurbina Alter, F. Liesa Mestres, and J. I. Iribarren Laco, Corrosión y protección, vol. 53, no. 9. 2003.
