Numerical Study Using CFD of the Cooling Process with Heat Exchangers in Computer Systems
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Published:
Jan 27, 2021
Keywords:
Cooling, CFD, ANSYS, heat exchanger.
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Abstract
This scientific article deals with the study and simulation of a radiator that is based on a cross-flow tubular heat exchanger, which has the purpose of cooling the processor, graphics card of a CPU or various hardware in computer systems. Various simulations are carried out in the ANSYS program having various inlet temperatures ranging from
75 °C to 90 °C and with different mass flows. The results show that, as the inlet temperature of the fluid to be cooled increases, the outlet of this fluid also increases. However, when mass flow is increased there is a decrease in heat rejection in computational devices.
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How to Cite
Toapanta, F., Cortéz, J., Quitiaquez, W., & Orellana, W. (2021). Numerical Study Using CFD of the Cooling Process with Heat Exchangers in Computer Systems. Revista Técnica "energía", 17(2), PP. 55–64. https://doi.org/10.37116/revistaenergia.v17.n2.2021.422
Section
EFICIENCIA ENERGÉTICA
Aviso de Derechos de Autor
La Revista Técnica "energía" está bajo licencia internacional Creative Commons Reconocimiento-NoComercial 4.0.
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[3] M. A. Kadhim, Y. T. Al-Anii, N. Kapur, J. L. Summers, and H. M. Thompson, “Performance of a mixed mode air handling unit for direct liquid-cooled servers,” Annu. IEEE Semicond. Therm. Meas. Manag. Symp., pp. 172–178, 2017, doi: 10.1109/SEMI-THERM.2017.7896926.
[4] S. J. Ovaska, R. E. Dragseth, and S. A. Hanssen, “Impact of retrofitted CPU water cooling on supercomputer performance and power consumption,” Conf. Proc. - IEEE SOUTHEASTCON, vol. 2016-July, pp. 1–2, 2016, doi: 10.1109/SECON.2016.7506669.
[5] N. Raja Kuppusamy and L. Poh Seng, “Study on thermal and hydrodynamic performance of a triple fluid heat exchanger with different passes and rows,” Energy Procedia, vol. 158, pp. 5901–5906, 2019, doi: 10.1016/j.egypro.2019.01.534.
[6] D. P. Kulkarni and R. Steinbrecher, “Compact liquid enhanced air cooling thermal solution for high power processors in existing air-cooled platforms,” Annu. IEEE Semicond. Therm. Meas. Manag. Symp., vol. Part F1214, pp. 81–85, 2016, doi: 10.1109/SEMI-THERM.2016.7458449.
[7] G. Tang, Y. Han, and X. Zhang, Compact heat exchanger design and energy efficiency optimization for data centre cooling application, vol. 2018-Febru. 2018.
[8] Y. Fan, C. Winkel, D. Kulkarni, and W. Tian, “Analytical Design Methodology for Liquid Based Cooling Solution for High TDP CPUs,” Proc. 17th Intersoc. Conf. Therm. Thermomechanical Phenom. Electron. Syst. ITherm 2018, pp. 582–586, 2018, doi: 10.1109/ITHERM.2018.8419562.
[9] T. A. Shedd and R. A. Morell, “Cooling 11.6 TFlops (1500 watts) in an office environment,” Annu. IEEE Semicond. Therm. Meas. Manag. Symp., pp. 122–124, 2017, doi: 10.1109/SEMI-THERM.2017.7896918.
[10] G. R. Wagner et al., “Test results from the comparison of three liquid cooling methods for high-power processors,” Proc. 15th Intersoc. Conf. Therm. Thermomechanical Phenom. Electron. Syst. ITherm 2016, pp. 619–624, 2016, doi: 10.1109/ITHERM.2016.7517605.
[11] A. C. Kheirabadi and D. Groulx, “Cooling of server electronics: A design review of existing technology,” Appl. Therm. Eng., vol. 105, no. 2016, pp. 622–638, 2016, doi: 10.1016/j.applthermaleng.2016.03.056.
[12] S. O. Tan and H. Demirel, “Performance and cooling efficiency of thermoelectric modules on server central processing unit and Northbridge,” Comput. Electr. Eng., vol. 46, pp. 46–55, 2015, doi: 10.1016/j.compeleceng.2015.07.012.
[13] A. C. Kheirabadi and D. Groulx, “Experimental evaluation of a thermal contact liquid cooling system for server electronics,” Appl. Therm. Eng., vol. 129, pp. 1010–1025, 2018, doi: 10.1016/j.applthermaleng.2017.10.098.
[14] W. Wang, L. Chen, Y. Kong, L. Yang, Y. Niu, and X. Du, “Cooling performance evaluation for double-layer configuration of air-cooled heat exchanger,” Int. J. Heat Mass Transf., vol. 151, p. 119396, 2020, doi: 10.1016/j.ijheatmasstransfer.2020.119396.
[15] S. Maalej, A. Zayoud, I. Abdelaziz, I. Saad, and M. C. Zaghdoudi, “Thermal performance of finned heat pipe system for Central Processing Unit cooling,” Energy Convers. Manag., vol. 218, no. February, p. 112977, 2020, doi: 10.1016/j.enconman.2020.112977.
[16] Y. Sun, T. Wang, L. Yang, L. Hu, and X. Zeng, “Research of an integrated cooling system consisted of compression refrigeration and pump-driven heat pipe for data centers,” Energy Build., vol. 187, pp. 16–23, 2019, doi: 10.1016/j.enbuild.2019.01.050.
[17] K. Liang, Z. Li, M. Chen, and H. Jiang, “Comparisons between heat pipe, thermoelectric system, and vapour compression refrigeration system for electronics cooling,” Appl. Therm. Eng., vol. 146, no. September 2018, pp. 260–267, 2019, doi: 10.1016/j.applthermaleng.2018.09.120.
[18] L. Bilurbina Alter, F. Liesa Mestres, and J. I. Iribarren Laco, Corrosión y protección, vol. 53, no. 9. 2003.
